Simulation of the Effect of Frequency and Aspect Ratio on Ribbon Bond Wire Performance

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Published Sep 11, 2021
Femi Robert
Muskan Puri Sanyukta Nair


Power electronics has become significant research area because of efficient electronic devices and power generation from renewable sources. The advances in power electronics increase the operating frequency of the power semiconductor devices in the range from 2 kHz to 200 MHz and current range from mA to MA [1]. This leads to significant challenge in power electronics packaging. Bonding wires are important component in packaging which is used to make interconnections between power semiconductor devices and other components such as integrated circuit, inductors, capacitors etc, [2]. The bond wire is made of materials such as aluminium, copper, silver and gold. Even though copper is less reliable due to its susceptibility to corrosion and hardness, it is most preferred because of cost [3, 4]. Round wires and ball bonders and commonly used by industries. Recently, ribbon bond wires become more popular because of reduced cross section area while maintaining or increasing the surface area [5, 6]. For high frequency applications, the proper design of bond wire is required in order to deduce the voltage drop and power loss across the bond wire [7]. At high frequencies, the resistance of the bond wires increases significantly as the result of skin effect.  This significantly cause power loss and reduces the overall system efficiency [8]. The frequency dependent impedance and power loss are essential in the design of bond wires in power electronics packages. In this work, the simulation of the effect of frequency and aspect ratio on the performance of the ribbon bond wire is presented. A copper ribbon bond wire is considered and 2D FEM electromagnetic simulation is carried out. The current density, resistance and power losses obtained for power frequency using simulation are compared with the calculated values. The performance parameters are obtained for the frequency range from 200 Hz to 20 MHz. Also, simulation is carried out to obtain the performance of the ribbon bond wires for the aspect ratios 6, 24, 54, 96 and 150. 

How to Cite

Robert, F., Muskan Puri, & Sanyukta Nair. (2021). Simulation of the Effect of Frequency and Aspect Ratio on Ribbon Bond Wire Performance. SPAST Abstracts, 1(01). Retrieved from
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Article Details


Power electronics, bond wires, finite element method, high frequency, skin effect

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